CNC Auto Soldering Machine SLC series > SLC01
Introduce
SLC is lateral moving comprehensive test machine. Comprehensive machine for prefluxing and solder dipping with high difficulty and high precision can make up automatic production line with other winding machines.
Machine Features
- SLC is lateral moving comprehensive soldering machine. Its working principle is that put the work piece on a machine arm, which can move backwards and forwards in a certain range; the work piece is brought to each station for prefluxing, solder plating, and inspection, etc. 3 to 4 stations may be set; and 2 to 12 work pieces may be simultaneously completed based on sizes of the work piece and actual requirements. For general standard functions, the first station is manual loading and unloading; the second station is automatic prefluxing; the third station is tin plating.
- All the key parts for this machine series are imported from Japan.They have compact structure, high rigidity, high precision, high speed and high intensity.
- With the adoption of Tanac's original special software for winding machines. various kinds of winding with high difficulties can be realized. With Windows programming, the operation is extremely easy, even for people who have never used Tanac software before.
- Automatic solder spatter cleaning function.
- With human-oriented design and firm and simple structure, it has fewer failures and convenient maintenance and repair.
Optional Accessories
- A station can be added.The fourth station can be added by appliance test NG automatic rejection or terminal reshaping and soon.
- The concentration management of soldering flux can be made into automatic system. Real-time testing by the sensor, if the concentration of the liquid changes, the diluting agent and soldering flux will be automatically added in order to reach the setting index.
- Liquid level in the solder groove can be tested by the sensor in real time. If the solder surface is lower than the set height, tin will be automatically added.
- A small solder groove which can move upwards and downwards may be added in the large solder groove.
Specifications
| Item\Type | SLC01 |
|---|---|
| Effective area of solder groove(mm) | 80×300 |
| Max. range for ascent and descent(mm) | 0~155 |
| Moving range from front to back(mm) | 0~620 |
| Rotation angle range | 0°~180° |
| Power voltage(V) | 1,500 |
| Max. temperature of the soldering pot | 520℃ |
| Air pressure(Mpa) | 0.49~0.59 |
| Machine size(mm) | 800(w)×1500(D)×1500(H) |
| Machine weight(kg) | 300 |